I am creating a rig to test the reliability of Copper Via Rivets. IN PROGRESS..
Latest Update: I’ve re-done the temp sensors using cat-6 twisted pair cable and some other components. When I can I’ll post pictures.
Update: I’ve been having problems with the temp sensors reading unreliably. I’ve tried several things to fix this, but really I have been trying to fix it blind, which is a bit of a pain and somewhat discouraging. What I really needed was an oscilloscope to be able to really see what’s happening. The one I found was about $355 on Amazon: Rigol DS1052E 50MHz DSO
I found another site where I could order it with free shipping for $336. It only took 10 days to receive the scope shipped from Hong Kong to near Los Angeles, from bestofferbuy.com. Their standard shipping included a USPS tracking number that worked fine. I’m impressed with it. The only issue was they sent it with a “China standard” plug… but the socket on the side of the scope takes a standard computer cord… no problem.
The interesting thing about this scope is that it can be switched to a 100 mhz scope by changing it’s model number etc using the USB port – the same hardware was used for both models! I’ve done it, no problem. This blog tells how.
This project will now continue, since I’ve figured a way out of my dilemma. I need to re-make the test board, and test a slight improvement in riveting while I’m waiting for the scope to arrive.
Update: I found some interesting information on the causes of thermal cycling induced failures in industry standard plated vias. According to this article the failure is due to weakness in the plated via wall, and that strengthening the via wall can eliminate the failures and can constrain the relatively weak expansion forces of the laminate. We will see if copper rivets will also behave as stronger vias (being many times stronger since they are solid).
Purpose: to determine if copper via rivets will fail due to thermal cycling. Assembly and programming are complete, and the test board is complete. Continue reading…











